- Length:
-
- Width:
-
- Attachment Method:
-
- Height Off Base (Height of Fin):
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- 선정 된 조건 :
9 제품 검색
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
Aavid, Thermal Division of Boyd Corporation |
18,047
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 14-16 DIP BLACK .19"
|
- | 0.250" (6.35mm) | 0.731" (18.57mm) | Thermal Tape, Adhesive (Not Included) | 0.190" (4.83mm) | 0.4W @ 30°C | 50.00°C/W @ 200 LFM | 68.00°C/W | ||||
ASSMANN WSW Components |
1,169
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | 0.748" (19.00mm) | 0.250" (6.35mm) | Press Fit | 0.189" (4.80mm) | - | - | 46.00°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
13,233
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 14-DIP/16-DIP
|
- | 0.750" (19.05mm) | 0.250" (6.35mm) | Thermal Tape, Adhesive (Not Included) | 0.190" (4.83mm) | 0.4W @ 30°C | 30.00°C/W @ 500 LFM | 67.00°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
4,831
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 14-16 DIP BLK ANODIZED
|
- | 0.890" (22.61mm) | 0.600" (15.24mm) | Press Fit, Slide On | 0.410" (10.42mm) | 1.0W @ 20°C | 12.00°C/W @ 200 LFM | 20.00°C/W | ||||
Wakefield-Vette |
4,555
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 14-16PIN DIP BLK
|
651 | 0.750" (19.05mm) | 0.415" (10.54mm) | Thermal Tape, Adhesive (Not Included) | 0.240" (6.10mm) | 0.5W @ 40°C | 40.00°C/W @ 300 LFM | - | ||||
ASSMANN WSW Components |
793
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | 0.250" (6.35mm) | 0.748" (19.00mm) | Press Fit | 0.190" (4.83mm) | - | - | 48.00°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | 0.750" (19.05mm) | 0.604" (15.34mm) | Thermal Tape, Adhesive (Not Included) | 0.212" (5.39mm) | 0.6W @ 40°C | 60.00°C/W @ 100 LFM | 60.00°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | 0.890" (22.61mm) | 0.600" (15.24mm) | Press Fit, Slide On | 0.410" (10.42mm) | 1.0W @ 20°C | 12.00°C/W @ 200 LFM | 20.00°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | 0.890" (22.61mm) | 0.600" (15.24mm) | Press Fit and PC Pin | 0.410" (10.42mm) | 1.0W @ 20°C | 12.00°C/W @ 200 LFM | 20.00°C/W |