- Series：
-
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
14 제품 검색
 |
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Material | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Material | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,250
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Copper | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Copper | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Copper | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
16,283
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .4" D2PAK
|
- | Copper | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | ||
|
|
|
Ohmite |
9,471
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263 BLACK
|
D | Aluminum | 1.020" (25.91mm) | Solderable Feet | TO-263 (D2Pak) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
|
Ohmite |
3,336
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263
|
D | Aluminum | 1.020" (25.91mm) | Solderable Feet | TO-263 (D2Pak) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
|
|
|
Ohmite |
1,763
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-268 BLACK
|
D | Aluminum | 1.220" (30.99mm) | Solderable Feet | TO-268 | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Black Anodized | ||
|
|
|
Apex Microtechnology |
31
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT
|
Apex Precision Power | Copper | 1.220" (30.99mm) | SMD Pad | SMD | - | 16.00°C/W @ 600 LFM | 50.00°C/W | Solderable | ||
|
|
|
Ohmite |
5
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-268
|
D | Aluminum | 1.220" (30.99mm) | Solderable Feet | TO-268 | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Degreased | ||
|
|
|
Wakefield-Vette |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM NATURAL SMD
|
218 | Copper | 1.030" (26.16mm) | SMD Pad | SMD | 2.3W @ 40°C | 5.00°C/W @ 600 LFM | 31.00°C/W | Tin | ||
|
|
|
Ohmite |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
TO-263 HEAT SINK / POLY TAPE
|
D | Aluminum | 1.020" (25.91mm) | Solderable Feet | TO-263 (D2Pak) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
|
|
|
Ohmite |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
TO-268 HEAT SINK /POLY TAPE
|
D | Aluminum | 1.220" (30.99mm) | Solderable Feet | TO-268 | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Degreased | ||
|
|
|
Ohmite |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
TO-263 HEAT SINK / POLY TAPE
|
D | Aluminum | 1.020" (25.91mm) | Solderable Feet | TO-263 (D2Pak) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
|
Ohmite |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
TO-268 HEAT SINK /POLY TAPE
|
D | Aluminum | 1.220" (30.99mm) | Solderable Feet | TO-268 | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Black Anodized |
