- Material：
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- Length：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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15 제품 검색
 |
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
ASSMANN WSW Components |
18,400
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
|
Top Mount | Copper | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | SMD Pad | D2Pak, TO-252 | - | - | 25.00°C/W | Tin | ||
|
|
|
ASSMANN WSW Components |
18,715
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
|
Top Mount | Copper | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | SMD Pad | D2Pak, TO-252 | - | - | 25.00°C/W | Tin | ||
|
|
|
ASSMANN WSW Components |
18,715
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
|
Top Mount | Copper | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | SMD Pad | D2Pak, TO-252 | - | - | 25.00°C/W | Tin | ||
|
|
|
ASSMANN WSW Components |
1,010
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | SMD Pad | TO-263 (D2Pak) | - | - | 23.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,743
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 VERT MNT W/TAB
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.810" (20.57mm) | Clip and PC Pin | TO-220 | 3.0W @ 60°C | 6.00°C/W @ 600 LFM | 21.20°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
10,420
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO220 VER MNT W/TAB.75"
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.810" (20.57mm) | Clip and PC Pin | TO-220 | 3.0W @ 60°C | 8.00°C/W @ 400 LFM | 21.20°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
3,600
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | SMD Pad | TO-263 (D2Pak) | - | - | 23.00°C/W | Tin | ||
|
|
|
ASSMANN WSW Components |
3,836
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | SMD Pad | TO-263 (D2Pak) | - | - | 23.00°C/W | Tin | ||
|
|
|
ASSMANN WSW Components |
3,836
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | SMD Pad | TO-263 (D2Pak) | - | - | 23.00°C/W | Tin | ||
|
|
Advanced Thermal Solutions Inc. |
2,969
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 VERT MNT W/TAB
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 0.752" (19.10mm) | 0.860" (21.84mm) | Bolt On and PC Pin | TO-220 | - | 11.00°C/W @ 200 LFM | 21.20°C/W | Black Anodized | |||
|
|
|
ASSMANN WSW Components |
430
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
|
Top Mount | Copper | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | SMD Pad | D2Pak, TO-252 | - | - | 25.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
11
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
65715 EXTRUSION 0.39X1"X4
|
Top Mount | Aluminum | Rectangular, Pin Fins | 48.000" (1219.20mm) | 0.985" (25.00mm) | Adhesive | - | - | - | - | - | ||
|
|
Advanced Thermal Solutions Inc. |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/TAB BLACK
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 0.752" (19.10mm) | 0.860" (21.84mm) | Clip and PC Pin | TO-220 | - | 10.50°C/W @ 200 LFM | 21.20°C/W | Black Anodized | |||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
BGA HEAT SINK
|
Top Mount | Aluminum | Square, Fins | 0.985" (25.02mm) | 0.985" (25.02mm) | Thermal Tape, Adhesive (Included) | BGA | - | 5.30°C/W @ 200 LFM | 10.00°C/W | Black Anodized | ||
|
|
|
Comair Rotron |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 26.2X12.7X9.9MM
|
Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | - | Tin |
