- Series：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
6 제품 검색
 |
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Shape | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Shape | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|
Advanced Thermal Solutions Inc. |
132
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 23MM X 23MM X 19.5MM
|
maxiGRIP, maxiFLOW | Square, Angled Fins | Clip, Thermal Material | - | 5.00°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
768
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 23MM X 23MM X 19.5MM
|
maxiGRIP | Square, Fins | Clip, Thermal Material | - | 7.30°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
54
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 23MM X 23MM X 19.5MM
|
- | Square, Fins | Thermal Tape, Adhesive (Included) | 0.3W @ 20°C | 7.30°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
99
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 23MM X 23MM X 19.5MM
|
- | Square, Fins | Thermal Tape, Adhesive (Included) | - | 7.80°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 23X23X19.5MM W/OUT TIM
|
- | Square, Fins | Thermal Tape, Adhesive (Not Included) | 0.3W @ 20°C | 7.30°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 23X23X19.5MM W/OUT TIM
|
- | Square, Fins | Thermal Tape, Adhesive (Not Included) | - | 7.80°C/W @ 200 LFM |
