- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
3 제품 검색
 |
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2,934
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TAB FOLD 55.12MM
|
Board Level, Vertical | 1.968" (49.99mm) | 1.986" (50.44mm) | Bolt On and PC Pin | TO-220 | 0.375" (9.52mm) | 1.75°C/W @ 800 LFM | 6.50°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
283
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-3 LOW PROFILE .375"
|
Board Level | 2.000" (50.80mm) | 1.750" (44.45mm) | Bolt On | TO-3 | 0.375" (9.52mm) | 3.00°C/W @ 400 LFM | 7.00°C/W | ||
|
|
|
Comair Rotron |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 17.8X44.5X12.7MM
|
Board Level | 0.700" (17.78mm) | 1.750" (44.45mm) | Bolt On | TO-220 | 0.500" (12.70mm) | 4.00°C/W @ 300 LFM | - |
