- Material：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
8 제품 검색
 |
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
11,699
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375" D2PAK
|
Top Mount | Copper | 0.590" (14.99mm) | 1.020" (25.91mm) | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 0.375" (9.52mm) | 2.0W @ 40°C | - | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
8,921
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TABS BLACK
|
Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 13.60°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Copper | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 13.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375" D2PAK
|
Top Mount | Copper | 0.590" (14.99mm) | 1.020" (25.91mm) | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 0.375" (9.52mm) | 2.0W @ 40°C | - | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | - | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 13.60°C/W | Tin | ||
|
|
|
Comair Rotron |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.9X15X9.5MM
|
Board Level | Copper | 0.590" (14.99mm) | 1.020" (25.91mm) | SMD Pad | TO-263 (D2Pak) | 0.375" (9.52mm) | 2.0W @ 40°C | - | Tin | ||
|
|
|
Comair Rotron |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 0.997" (25.33mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | - | Black Anodized | ||
|
|
|
Comair Rotron |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | - | Black Anodized |
