- Length：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
12 제품 검색
 |
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|
|
|
Wakefield-Vette |
2,779
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.600" (15.24mm) | 2.5W @ 30°C | - | ||
|
|
|
Wakefield-Vette |
7,117
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 27.9MM SQ W/ADH BLK
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.598" (15.20mm) | 2.5W @ 30°C | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,336
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDERPIN/CLIP
|
- | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | Clip and PC Pin | TO-220 | 1.000" (25.40mm) | 8.0W @ 40°C | 5.00°C/W | ||
|
|
|
Wakefield-Vette |
4,276
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/OTAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.598" (15.20mm) | 2.5W @ 30°C | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2,040
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 10W H=1.5" BLK
|
- | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On | TO-220 | 1.000" (25.40mm) | 8.0W @ 40°C | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,120
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-218 W/PINS 1.5"TALL
|
- | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218 | 1.000" (25.40mm) | 10.0W @ 50°C | 5.00°C/W | ||
|
|
|
Wakefield-Vette |
2,122
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.598" (15.20mm) | 2.5W @ 30°C | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,006
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-3 1.00" BLK
|
- | Board Level | Rhombus | 1.880" (47.75mm) | 1.400" (35.56mm) | Bolt On | TO-3 | 1.000" (25.40mm) | 5.0W @ 40°C | 8.40°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-3 14W H=0.82" BLK
|
- | Board Level | Square, Pin Fins | 2.500" (63.50mm) | 2.500" (63.50mm) | Bolt On | TO-3 | 0.821" (20.86mm) | 6.0W @ 40°C | 4.90°C/W | ||
|
|
|
Wakefield-Vette |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.598" (15.20mm) | 2.5W @ 30°C | - | ||
|
|
|
Wakefield-Vette |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.598" (15.20mm) | 2.5W @ 30°C | - | ||
|
|
|
Wakefield-Vette |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 27.9MM SQ W/ADH BLK
|
658 | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.598" (15.20mm) | 2.5W @ 30°C | - |
