- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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2 제품 검색
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이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
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Wakefield-Vette |
158
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3 일 |
-
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MOQ: 1 MPQ: 1
|
HEATSINK EXTRUSION 12.32"
|
12.320" (312.93mm) | 3.420" (86.87mm) | - | Adhesive | Power Modules | 1.630" (41.40mm) | - | 0.95°C/W | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
문의
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-5 .5" BLACK
|
0.500" (12.70mm) | 0.830" (21.08mm) | 0.316" (8.03mm) ID | Press Fit | TO-5 | 0.395" (10.03mm) | 1.4W @ 50°C | 38.00°C/W | Black Anodized |
