- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
3 제품 검색
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이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|
Advanced Thermal Solutions Inc. |
78
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 33MM X 33MM X 14.5MM
|
Top Mount | Square, Pin Fins | 1.299" (32.99mm) | 1.299" (32.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | - | - | |||
|
|
|
CUI Inc. |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 3.2W ALUMINUM
|
Board Level, Vertical | Rectangular, Fins | 0.500" (12.70mm) | 0.500" (12.70mm) | PC Pin | TO-220 | 0.748" (19.00mm) | 3.2W @ 75°C | 23.81°C/W | ||
|
|
Advanced Thermal Solutions Inc. |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 33X33X14.5MM W/OUT TIM
|
Top Mount | Square, Pin Fins | 1.299" (32.99mm) | 1.299" (32.99mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.571" (14.50mm) | - | - |
