- Series:
-
- Length:
-
- Width:
-
- Diameter:
-
- Attachment Method:
-
- Package Cooled:
-
- Height Off Base (Height of Fin):
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Material Finish:
-
23 제품 검색
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | ||
Aavid, Thermal Division of Boyd Corporation |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Aluminum | Rhombus | 1.630" (41.40mm) | 1.290" (32.77mm) | - | Bolt On | TO-3 | 1.000" (25.40mm) | 5.0W @ 50°C | 3.50°C/W @ 200 LFM | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.375" (34.93mm) | - | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | Black Anodized | ||||
TE Connectivity AMP Connectors |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK BGA 37.5MM 3FIN RADIAL
|
- | - | Aluminum | Cylindrical | - | - | 1.375" (34.92mm) OD | Clip | BGA | 0.479" (12.17mm) | - | 5.70°C/W @ 200 LFM | Black Anodized |