- Material：
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- Length：
-
- Width：
-
- Diameter：
-
- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
17 제품 검색
 |
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,250
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | Tin | ||
|
|
|
Wakefield-Vette |
547
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-5 EPOXY INSUL BLK
|
260 | Board Level | Beryllium Copper | Cylindrical | 0.370" (9.40mm) | 0.380" (9.65mm) | 0.290" (7.37mm) ID | Bolt On | TO-5 | - | - | - | Black Ebonol | ||
|
|
|
ASSMANN WSW Components |
1,179
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.374" (34.90mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | - | - | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
2,270
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.185" (55.50mm) | 1.378" (35.00mm) | - | Bolt On and Board Mounts | TO-220 | 0.500" (12.70mm) | - | - | Black Anodized | ||
|
|
|
Ohmite |
499
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
BLACK ANODIZED HEATSINK
|
EX | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.641" (16.28mm) | 0.642" (16.30mm) | - | Bolt On and Board Mounts | TO-247 | 1.500" (38.10mm) | 4.0W @ 70°C | 4.00°C/W @ 300 LFM | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
294
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.374" (34.90mm) | - | PC Pin | SOT-32, TO-220, TOP-3 | 0.500" (12.70mm) | - | - | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
406
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TOP-3 TO-220 SOT-32
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.374" (34.90mm) | - | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | 0.500" (12.70mm) | - | - | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
838
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.185" (55.50mm) | 1.378" (35.00mm) | - | Bolt On and Board Mounts | TO-220 | 0.500" (12.70mm) | - | - | Tin | ||
|
|
|
Ohmite |
302
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
BLACK ANODIZED HEATSINK
|
EX | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.641" (16.28mm) | 0.642" (16.30mm) | - | Bolt On and Board Mounts | TO-220 | 1.500" (38.10mm) | 3.0W @ 50°C | 5.00°C/W @ 200 LFM | Black Anodized | ||
|
|
Wakefield-Vette |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK VERT ALUM BLK TO-220
|
206 | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 4.0W @ 56°C | 7.30°C/W @ 200 LFM | Black Anodized | |||
|
|
|
Wakefield-Vette |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK VERT ALUM BLACK TO-220
|
265 | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 4.0W @ 56°C | 7.00°C/W @ 200 LFM | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Top Mount | - | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | Tin | ||
|
|
|
Wakefield-Vette |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
CUP CLIP TRANSISTOR C3488 REV H
|
260 | Board Level | Beryllium Copper | Cylindrical | 0.400" (10.16mm) | 0.370" (9.40mm) | 0.290" (7.37mm) ID | Bolt On | TO-5 | - | - | - | Black Ebonol | ||
|
|
|
Wakefield-Vette |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK FOR TO-5 PKG
|
260 | Board Level | Beryllium Copper | Cylindrical | 0.557" (14.15mm) | 0.370" (9.40mm) | 0.290" (7.37mm) ID | Bolt On | TO-5 | - | - | - | Black Ebonol | ||
|
|
|
CTS Thermal Management Products |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW PROFILE BLK TO-220
|
7 | Board Level | Aluminum | Rectangular, Fins | 0.682" (17.32mm) | 1.750" (44.45mm) | - | Bolt On and PC Pin | TO-220 | 0.375" (9.52mm) | 3.0W @ 40°C | - | Black Anodized |
