- Attachment Method：
-
- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- 선정 된 조건 :
3 제품 검색
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이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
CTS Thermal Management Products |
113
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.71"SQ
|
BDN | Top Mount | Square, Pin Fins | 1.710" (43.43mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 3.80°C/W @ 400 LFM | 11.50°C/W | Black Anodized | ||
|
|
|
Ohmite |
92
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK DUAL FOR TO-220/247 BLK
|
W | Board Level, Vertical | Rectangular, Fins | 1.200" (30.48mm) | Clip and PC Pin | TO-220, TO-247 (Dual) | 0.630" (16.00mm) | 4.0W @ 40°C | 6.00°C/W @ 200 LFM | 5.00°C/W | Black Anodized | ||
|
|
|
Ohmite |
27
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK DUAL FOR TO-220/247
|
W | Board Level, Vertical | Rectangular, Fins | 1.200" (30.48mm) | Clip and PC Pin | TO-220, TO-247 (Dual) | 0.630" (16.00mm) | 4.0W @ 40°C | 6.00°C/W @ 200 LFM | 6.00°C/W | Degreased |
