- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
8 제품 검색
 |
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Type | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Type | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,384
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/TAB .375"
|
Board Level, Vertical | Aluminum | 0.750" (19.05mm) | Bolt On and PC Pin | TO-220 | 0.375" (9.52mm) | 8.00°C/W @ 400 LFM | 25.90°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,215
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .515"TO-220
|
Board Level, Vertical | Copper | 0.848" (21.55mm) | Clip and PC Pin | TO-220 | 0.515" (13.08mm) | 6.00°C/W @ 500 LFM | 19.70°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
7,409
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-202 LOW PROFILE.375"
|
Board Level | Aluminum | 0.750" (19.05mm) | Bolt On | TO-202 | 0.375" (9.52mm) | 8.00°C/W @ 500 LFM | 27.20°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
761
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .515"TO-220
|
Board Level, Vertical | Copper | 0.780" (19.81mm) | Clip and PC Pin | TO-220 | 0.515" (13.08mm) | 10.00°C/W @ 200 LFM | 20.30°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
976
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TIN CLIP-ON 21MM
|
Board Level | Copper | 0.780" (19.81mm) | Clip and Board Locks | TO-220 | 0.515" (13.08mm) | 8.00°C/W @ 400 LFM | 20.30°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | 0.750" (19.05mm) | Bolt On | TO-220 | 0.330" (8.38mm) | 7.00°C/W @ 300 LFM | 22.50°C/W | Black Anodized | ||
|
|
|
Comair Rotron |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 9.5X13.2X19.1MM
|
Board Level, Vertical | Aluminum | 0.750" (19.05mm) | Bolt On and PC Pin | TO-220 | 0.375" (9.52mm) | 12.00°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
Comair Rotron |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 9.5X13.2X19.1MM
|
Board Level | Aluminum | 0.750" (19.05mm) | Bolt On | TO-220 | 0.375" (9.52mm) | 12.00°C/W @ 200 LFM | - | Black Anodized |
