- Type：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
6 제품 검색
 |
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Type | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Type | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,500
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
Top Mount | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,648
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
Top Mount | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,648
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
Top Mount | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,216
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .45" D2PAK
|
Top Mount | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | ||
|
|
|
ASSMANN WSW Components |
626
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 19.38X25.40MM
|
Top Mount | - | - | 23.00°C/W | ||
|
|
|
Comair Rotron |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19.4X25.4X11.4MM
|
Board Level | 1.5W @ 20°C | 4.00°C/W @ 200 LFM | - |
