- Material：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
16 제품 검색
 |
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|
|
|
Wakefield-Vette |
2,795
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS BLK 1"
|
647 | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 6.0W @ 42°C | 3.80°C/W @ 200 LFM | Black Anodized | ||
|
|
|
t-Global Technology |
120
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X25.4X0.062MM
|
PH3n | Heat Spreader | Copper | Rectangular | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
78
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
PH3 101.6X25.4X0.21MM
|
PH3 | Heat Spreader | Copper | Rectangular | 4.000" (101.60mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
44
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X25.4X0.07MM
|
PH3n | Heat Spreader | Copper | Rectangular | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
9
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 101.6X25.4X0.062MM
|
PH3n | Heat Spreader | Copper | Rectangular | 4.000" (101.60mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
7
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 101.6X25.4X0.07MM
|
PH3n | Heat Spreader | Copper | Rectangular | 4.000" (101.60mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | Polyester | ||
|
|
|
t-Global Technology |
20
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
PH3 76.2X25.4X0.21MM
|
PH3 | Heat Spreader | Copper | Rectangular | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | Polyester | ||
|
|
|
CTS Thermal Management Products |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK VERT W/TABS BLK TO-220
|
7 | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.190" (30.23mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 2.5W @ 40°C | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CLIP ON BLACK TO-220
|
PA2-7 | Board Level | Aluminum | Rectangular, Fins | 0.710" (18.03mm) | Clip | TO-202 | 0.310" (7.87mm) | 0.5W @ 40°C | - | Black Anodized | ||
|
|
|
Comair Rotron |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
- | Board Level, Vertical | Copper | Rectangular, Fins | 1.180" (29.97mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | Tin | ||
|
|
|
Comair Rotron |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19.4X25.4X11.4MM
|
- | Board Level | Copper | Rectangular, Fins | 0.763" (19.38mm) | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 1.5W @ 20°C | 4.00°C/W @ 200 LFM | Tin | ||
|
|
|
Comair Rotron |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.942" (23.92mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | Black Anodized | ||
|
|
|
Comair Rotron |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | Black Anodized | ||
|
|
|
Comair Rotron |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 5.00°C/W @ 400 LFM | Black Anodized | ||
|
|
|
Comair Rotron |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
- | Board Level, Vertical | Copper | Rectangular, Fins | 1.180" (29.97mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | Black Paint | ||
|
|
|
Comair Rotron |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 30°C | 5.00°C/W @ 500 LFM | Black Anodized |
