- Packaging：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Peripherals：
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- Core Processor：
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- RAM Size：
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- Program Memory Size：
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- Voltage - Supply (Vcc/Vdd)：
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- Data Converters：
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- Oscillator Type：
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8 제품 검색
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이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
|
|
|
NXP USA Inc. |
17
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 169MAPBGA
|
Tray | Kinetis K27F | -40°C ~ 105°C (TA) | 169-LFBGA | 169-MAPBGA (9x9) | DMA，I2S，PWM，WDT | ARM Cortex-M4 | 1M x 8 | 2MB (2M x 8) | 1.71 V ~ 3.6 V | A/D 16b SAR，D/A 2x6b，1x12b | Internal/External | EBI/EMI，I2C，QSPI，SDHC，SPI，UART/USART，USB | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 208MAPBGA
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 208-BGA | 208-MAPBGA (17x17) | DMA，POR，PWM，WDT | e200z4 | 192K x 8 | 4MB (4M x 8) | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | CANbus，EBI/EMI，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 208MAPBGA
|
Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 208-BGA | 208-MAPBGA (17x17) | DMA，POR，PWM，WDT | e200z4 | 192K x 8 | 4MB (4M x 8) | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | CANbus，EBI/EMI，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 169MAPBGA
|
Tray | Kinetis K28F | -40°C ~ 105°C (TA) | 169-LFBGA | 169-MAPBGA (9x9) | DMA，I2S，PWM，WDT | ARM Cortex-M4 | 1M x 8 | 2MB (2M x 8) | 1.71 V ~ 3.6 V | A/D 16b SAR，D/A 2x6b，1x12b | Internal/External | EBI/EMI，I2C，QSPI，SDHC，SPI，UART/USART，USB | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 3000 MPQ: 1
|
150MHZ ARM CORTEX-M4F
|
Tape & Reel (TR) | Kinetis K27F | -40°C ~ 85°C (TA) | 210-UFBGA，WLCSP | 210-WLCSP (6.93x6.93) | DMA，I2S，PWM，WDT | ARM Cortex-M4 | 1M x 8 | 2MB (2M x 8) | 1.71 V ~ 3.6 V | A/D 16b SAR，D/A 2x6b，1x12b | Internal/External | EBI/EMI，I2C，QSPI，SDHC，SPI，UART/USART，USB | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 260 MPQ: 1
|
150MHZ ARM CORTEX 1.3
|
Tray | Kinetis K27F | -40°C ~ 105°C (TA) | 169-LFBGA | 169-MAPBGA (9x9) | DMA，I2S，PWM，WDT | ARM Cortex-M4 | 1M x 8 | 2MB (2M x 8) | 1.71 V ~ 3.6 V | A/D 16b SAR，D/A 2x6b，1x12b | Internal/External | EBI/EMI，I2C，QSPI，SDHC，SPI，UART/USART，USB | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 210WLCSP
|
Tape & Reel (TR) | Kinetis K28F | -40°C ~ 85°C (TA) | 210-UFBGA，WLCSP | 210-WLCSP (6.93x6.93) | DMA，I2S，PWM，WDT | ARM Cortex-M4 | 1M x 8 | 2MB (2M x 8) | 1.71 V ~ 3.6 V | A/D 16b SAR，D/A 2x6b，1x12b | Internal/External | EBI/EMI，I2C，QSPI，SDHC，SPI，UART/USART，USB | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 260 MPQ: 1
|
150MHZ ARM CORTEX 1.3
|
Tray | Kinetis K27F | -40°C ~ 105°C (TA) | 169-LFBGA | 169-MAPBGA (9x9) | DMA，I2S，PWM，WDT | ARM Cortex-M4 | 1M x 8 | 2MB (2M x 8) | 1.71 V ~ 3.6 V | A/D 16b SAR，D/A 2x6b，1x12b | Internal/External | EBI/EMI，I2C，QSPI，SDHC，SPI，UART/USART，USB |
