- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Peripherals：
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- Core Processor：
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- Program Memory Size：
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- Voltage - Supply (Vcc/Vdd)：
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- Data Converters：
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- Oscillator Type：
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- Core Size：
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87 제품 검색
 |
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Core Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Core Size | |
|
|
|
NXP USA Inc. |
876
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 100LQFP
|
Tray | MCF5222x | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA，LVD，POR，PWM，WDT | Coldfire V2 | 56 | 66MHz | 32K x 8 | 256KB (256K x 8) | 3 V ~ 3.6 V | A/D 8x12b | Internal | 32-Bit | ||
|
|
|
NXP USA Inc. |
830
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 100LQFP
|
Tray | MCF5222x | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA，LVD，POR，PWM，WDT | Coldfire V2 | 56 | 80MHz | 32K x 8 | 256KB (256K x 8) | 3 V ~ 3.6 V | A/D 8x12b | Internal | 32-Bit | ||
|
|
|
NXP USA Inc. |
5,000
|
3 일 |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS L 32-BIT MCU ARM CORTEX-
|
Tape & Reel (TR) | Kinetis KL8 | -40°C ~ 105°C (TA) | 64-XFBGA，WLCSP | 64-WLCSP (3.48x3.38) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 41 | 72MHz | 96K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 11x16b，D/A 1x6b，1x12b | Internal | 32-Bit | ||
|
|
|
NXP USA Inc. |
124
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tray | MCF5222x | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，LVD，POR，PWM，WDT | Coldfire V2 | 56 | 66MHz | 16K x 8 | 128KB (128K x 8) | 3 V ~ 3.6 V | A/D 8x12b | Internal | 32-Bit | ||
|
|
|
NXP USA Inc. |
566
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 100LQFP
|
Tray | MCF5221x | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA，LVD，POR，PWM，WDT | Coldfire V2 | 63 | 80MHz | 16K x 8 | 128KB (128K x 8) | 3 V ~ 3.6 V | A/D 8x12b | Internal | 32-Bit | ||
|
|
|
NXP USA Inc. |
490
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32QFN
|
Tray | MCF51Jx | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | DMA，I2S，LVD，POR，PWM，WDT | Coldfire V1 | 22 | 50MHz | 8K x 8 | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D 6x12b，D/A 1x12b | External | 32-Bit | ||
|
|
|
NXP USA Inc. |
2,000
|
3 일 |
-
|
MOQ: 2000 MPQ: 1
|
KINETIS L 32-BIT MCU ARM CORTEX
|
Tape & Reel (TR) | Kinetis KL8 | -40°C ~ 105°C (TA) | 121-LFBGA | 121-MAPBGA (8x8) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 85 | 72MHz | 96K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 12x16b，D/A 1x6b，1x12b | Internal | 32-Bit | ||
|
|
|
NXP USA Inc. |
2,000
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
KINETIS L 32-BIT MCU ARM CORTEX
|
Cut Tape (CT) | Kinetis KL8 | -40°C ~ 105°C (TA) | 121-LFBGA | 121-MAPBGA (8x8) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 85 | 72MHz | 96K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 12x16b，D/A 1x6b，1x12b | Internal | 32-Bit | ||
|
|
|
NXP USA Inc. |
2,000
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
KINETIS L 32-BIT MCU ARM CORTEX
|
- | Kinetis KL8 | -40°C ~ 105°C (TA) | 121-LFBGA | 121-MAPBGA (8x8) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 85 | 72MHz | 96K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 12x16b，D/A 1x6b，1x12b | Internal | 32-Bit | ||
|
|
|
NXP USA Inc. |
348
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
KINETIS L 32-BIT MCU ARM CORTEX
|
Tray | Kinetis KL8 | -40°C ~ 105°C (TA) | 121-LFBGA | 121-MAPBGA (8x8) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 85 | 72MHz | 96K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 12x16b，D/A 1x6b，1x12b | Internal | 32-Bit | ||
|
|
|
NXP USA Inc. |
800
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | MCF5221x | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，LVD，POR，PWM，WDT | Coldfire V2 | 56 | 50MHz | 8K x 8 | 64KB (64K x 8) | 3 V ~ 3.6 V | A/D 8x12b | Internal | 32-Bit | ||
|
|
|
NXP USA Inc. |
60
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | MCF5221x | 0°C ~ 70°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，LVD，POR，PWM，WDT | Coldfire V2 | 56 | 50MHz | 8K x 8 | 64KB (64K x 8) | 3 V ~ 3.6 V | A/D 8x12b | Internal | 32-Bit | ||
|
|
|
NXP USA Inc. |
45
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tray | MCF5221x | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，LVD，POR，PWM，WDT | Coldfire V2 | 43 | 66MHz | 16K x 8 | 128KB (128K x 8) | 3 V ~ 3.6 V | A/D 8x12b | Internal | 32-Bit | ||
|
|
|
NXP USA Inc. |
95
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
KINETIS KL81: 72MHZ CORTEX-M0+ S
|
Tray | Kinetis KL8 | -40°C ~ 105°C (TA) | 80-LQFP | 80-FQFP (12x12) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 56 | 72MHz | 96K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 12x16b，D/A 1x6b，1x12b | Internal | 32-Bit | ||
|
|
|
NXP USA Inc. |
83
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 121BGA
|
Tray | Kinetis KL8 | -40°C ~ 105°C (TA) | 121-LFBGA | 121-MAPBGA (8x8) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 85 | 72MHz | 96K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 12x16b，D/A 1x6b，1x12b | Internal | 32-Bit | ||
|
|
|
NXP USA Inc. |
104
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 80LQFP
|
Tray | Kinetis KL8 | -40°C ~ 105°C (TA) | 80-LQFP | 80-FQFP (12x12) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 56 | 72MHz | 96K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 12x16b，D/A 1x6b，1x12b | Internal | 32-Bit | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 121BGA
|
Tray | Kinetis K20 | -40°C ~ 105°C (TA) | 121-XFBGA | 121-MAPBGA (8x8) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M4 | 83 | 120MHz | 256K x 8 | 256KB (256K x 8) | 1.71 V ~ 3.6 V | A/D 37x16b，D/A 2x12b | Internal | 32-Bit | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 490 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32QFN
|
Tray | MCF51Jx | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | DMA，I2S，LVD，POR，PWM，WDT | Coldfire V1 | 22 | 50MHz | 8K x 8 | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D 6x12b，D/A 1x12b | External | 32-Bit | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 1000 MPQ: 1
|
KINETIS L 32-BIT MCU ARM CORTEX
|
Tape & Reel (TR) | Kinetis KL8 | -40°C ~ 105°C (TA) | 80-LQFP | 80-FQFP (12x12) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 56 | 72MHz | 96K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 12x16b，D/A 1x6b，1x12b | Internal | 32-Bit | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 640 MPQ: 1
|
KINETIS KL82: 72MHZ CORTEX-M0+ S
|
Tray | Kinetis KL8 | -40°C ~ 105°C (TA) | 64-LFBGA | 64-LFBGA (5x5) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 41 | 72MHz | 96K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 11x16b，D/A 1x6b，1x12b | Internal | 32-Bit |
