- Series:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Core Processor:
-
- Voltage - I/O:
-
- Speed:
-
- Number of Cores/Bus Width:
-
- Co-Processors/DSP:
-
- RAM Controllers:
-
- Display & Interface Controllers:
-
- USB:
-
- Security Features:
-
- 선정 된 조건 :
569 제품 검색
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | USB | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | USB | Security Features | ||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MPU I.MX53 800MHZ 529TEBGA
|
Tray | i.MX53 | -40°C ~ 125°C (TJ) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V,1.8V,2.775V,3.3V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,DDR2,DDR3 | Yes | Keypad,LCD | SATA 1.5Gbps (1) | USB 2.0 (2),USB 2.0 + PHY (2) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MPU I.MX53 1.0GHZ 529TEBGA-2
|
Tray | i.MX53 | -20°C ~ 85°C (TC) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V,1.8V,2.775V,3.3V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,DDR2,DDR3 | Yes | Keypad,LCD | SATA 1.5Gbps (1) | USB 2.0 (2),USB 2.0 + PHY (2) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MPU I.MX53 800MHZ 529TEBGA
|
Tray | i.MX53 | -40°C ~ 125°C (TJ) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V,1.8V,2.775V,3.3V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,DDR2,DDR3 | Yes | Keypad,LCD | SATA 1.5Gbps (1) | USB 2.0 (2),USB 2.0 + PHY (2) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MPU I.MX53 800MHZ 529TEBGA
|
Tray | i.MX53 | -40°C ~ 85°C (TA) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V,1.8V,2.775V,3.3V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,DDR2,DDR3 | Yes | Keypad,LCD | SATA 1.5Gbps (1) | USB 2.0 (2),USB 2.0 + PHY (2) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tape & Reel (TR) | i.MX50 | 0°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD | - | USB 2.0 + PHY (2) | Boot Security,Cryptography,Secure JTAG | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU I.MX50 800MHZ 416MAPBGA
|
Tape & Reel (TR) | i.MX50 | 0°C ~ 70°C (TA) | 416-LFBGA | 416-MAPBGA (13x13) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD | - | USB 2.0 + PHY (2) | Boot Security,Cryptography,Secure JTAG | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 320 MPQ: 1
|
IC MPU I.MX50 800MHZ 416MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | 416-LFBGA | 416-MAPBGA (13x13) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD | - | USB 2.0 + PHY (2) | Boot Security,Cryptography,Secure JTAG | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 270 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tray | i.MX50 | -20°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD | - | USB 2.0 + PHY (2) | Boot Security,Cryptography,Secure JTAG | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 320 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V,1.8V,3.0V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | - | USB 2.0 + PHY (3) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 320 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V,1.8V,3.0V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | - | USB 2.0 + PHY (3) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 320 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V,1.8V,3.0V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | - | USB 2.0 + PHY (3) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 320 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V,1.8V,3.0V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | - | USB 2.0 + PHY (3) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 320 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V,1.8V,3.0V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | - | USB 2.0 + PHY (3) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 152 MPQ: 1
|
IC MPU I.MC6UL 528MHZ 289BGA
|
Tray | i.MX6UL | 0°C ~ 95°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.2V,1.35V,1.5V,1.8V,2.5V,2.8V,3.3V | 528MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,DDR3,DDR3L | No | LVDS | - | USB 2.0 + PHY (1) | ARM TZ,A-HAB,CAAM,CSU,SJC,SNVS | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 152 MPQ: 1
|
IC MPU I.MC6UL 528MHZ 289BGA
|
Tray | i.MX6UL | -40°C ~ 125°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.2V,1.35V,1.5V,1.8V,2.5V,2.8V,3.3V | 528MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,DDR3,DDR3L | No | LVDS | - | USB 2.0 + PHY (2) | ARM TZ,A-HAB,CAAM,CSU,SJC,SNVS | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 152 MPQ: 1
|
IC MPU I.MC6UL 696MHZ 289BGA
|
Tray | i.MX6UL | -40°C ~ 125°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.2V,1.35V,1.5V,1.8V,2.5V,2.8V,3.3V | 696MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,DDR3,DDR3L | No | LVDS | - | USB 2.0 + PHY (2) | ARM TZ,A-HAB,CAAM,CSU,SJC,SNVS | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 152 MPQ: 1
|
IC MPU I.MC6UL 528MHZ 289BGA
|
Tray | i.MX6UL | -40°C ~ 105°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.2V,1.35V,1.5V,1.8V,2.5V,2.8V,3.3V | 528MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,DDR3,DDR3L | No | LVDS | - | USB 2.0 + PHY (2) | ARM TZ,A-HAB,CAAM,CSU,SJC,SNVS | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
I.MXRT1050
|
Tray | - | -40°C ~ 105°C (TJ) | 196-LFBGA | 196-MAPBGA (10x10) | ARM® Cortex®-M7 | 1.8V,2.8V,3.3V | 528MHz | 1 Core,32-Bit | - | SDRAM | Yes | LCD | - | USB 2.0 OTG + PHY (2) | BEE,DCP,HAB,SJC,SNVS,TRNG | ||||
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
I.MXRT1050
|
Tray | - | 0°C ~ 95°C (TJ) | 196-LFBGA | 196-MAPBGA (10x10) | ARM® Cortex®-M7 | 1.8V,2.8V,3.3V | 600MHz | 1 Core,32-Bit | - | SDRAM | Yes | LCD | - | USB 2.0 OTG + PHY (2) | BEE,DCP,HAB,SJC,SNVS,TRNG | ||||
Microchip Technology |
587
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
Tray | SAMA5D2 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | 1 Core,32-Bit | Multimedia; NEON® MPE | LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI | Yes | Keyboard,LCD,Touchscreen | - | USB 2.0 + HSIC | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC |