- Series:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Core Processor:
-
- Voltage - I/O:
-
- Speed:
-
- Number of Cores/Bus Width:
-
- Co-Processors/DSP:
-
- RAM Controllers:
-
- Display & Interface Controllers:
-
- USB:
-
- Security Features:
-
- 선정 된 조건 :
569 제품 검색
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | USB | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | USB | Security Features | ||
Microchip Technology |
문의
|
- |
-
|
MOQ: 1000 MPQ: 1
|
BGA GREEN,IND TEMP
|
Tape & Reel (TR) | SAMA5D4 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Microchip Technology |
960
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
BGA GREEN,IND TEMP
|
Cut Tape (CT) | SAMA5D4 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Microchip Technology |
960
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
BGA GREEN,IND TEMP
|
- | SAMA5D4 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
NXP USA Inc. |
1,000
|
3 일 |
-
|
MOQ: 1000 MPQ: 1
|
I.MX25 32-BIT MPU ARM926EJ-S CO
|
Tape & Reel (TR) | i.MX25 | -40°C ~ 85°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM926EJ-S | 2.0V,2.5V,2.7V,3.0V,3.3V | 400MHz | 1 Core,32-Bit | - | LPDDR,DDR,DDR2 | No | Keypad,LCD,Touchscreen | - | USB 2.0 + PHY (2) | - | ||||
NXP USA Inc. |
204
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
528MHZ,ETHERNET X1,USB OTG X1,
|
Tray | i.MX6 | -40°C ~ 105°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.8V,2.8V,3.3V | 528MHz | 1 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,DDR3,DDR3L | No | Electrophoretic,LCD | - | USB 2.0 OTG + PHY (1) | A-HAB,ARM TZ,CSU,SJC,SNVS | ||||
Microchip Technology |
문의
|
- |
-
|
MOQ: 1000 MPQ: 1
|
BGA GREEN,IND TEMP
|
Tape & Reel (TR) | SAMA5D4 | -40°C ~ 85°C (TA) | 361-TFBGA | 361-TFBGA (16x16) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Microchip Technology |
680
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
BGA GREEN,IND TEMP
|
Cut Tape (CT) | SAMA5D4 | -40°C ~ 85°C (TA) | 361-TFBGA | 361-TFBGA (16x16) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Microchip Technology |
680
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
BGA GREEN,IND TEMP
|
- | SAMA5D4 | -40°C ~ 85°C (TA) | 361-TFBGA | 361-TFBGA (16x16) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Microchip Technology |
109
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB ROM 289LFBGA
|
Tray | SAMA5D4 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Microchip Technology |
문의
|
- |
-
|
MOQ: 1000 MPQ: 1
|
BGA GREEN,IND TEMP
|
Tape & Reel (TR) | SAMA5D4 | -40°C ~ 85°C (TA) | 361-TFBGA | 361-TFBGA (16x16) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Microchip Technology |
989
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
BGA GREEN,IND TEMP
|
Cut Tape (CT) | SAMA5D4 | -40°C ~ 85°C (TA) | 361-TFBGA | 361-TFBGA (16x16) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Microchip Technology |
989
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
BGA GREEN,IND TEMP
|
- | SAMA5D4 | -40°C ~ 85°C (TA) | 361-TFBGA | 361-TFBGA (16x16) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Microchip Technology |
문의
|
- |
-
|
MOQ: 1500 MPQ: 1
|
BGA GREEN,IND TEMP,MRLC,128MBIT
|
Tape & Reel (TR) | SAMA5D2 | -40°C ~ 85°C (TA) | 196-TFBGA,CSBGA | 196-TFBGA (11x11) | ARM® Cortex®-A5 | 3.3V | 500MHz | 1 Core,32-Bit | Multimedia; NEON® MPE | LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI | Yes | Keyboard,LCD,Touchscreen | - | USB 2.0 + HSIC | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
Microchip Technology |
1,475
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
BGA GREEN,IND TEMP,MRLC,128MBIT
|
Cut Tape (CT) | SAMA5D2 | -40°C ~ 85°C (TA) | 196-TFBGA,CSBGA | 196-TFBGA (11x11) | ARM® Cortex®-A5 | 3.3V | 500MHz | 1 Core,32-Bit | Multimedia; NEON® MPE | LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI | Yes | Keyboard,LCD,Touchscreen | - | USB 2.0 + HSIC | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
Microchip Technology |
1,475
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
BGA GREEN,IND TEMP,MRLC,128MBIT
|
- | SAMA5D2 | -40°C ~ 85°C (TA) | 196-TFBGA,CSBGA | 196-TFBGA (11x11) | ARM® Cortex®-A5 | 3.3V | 500MHz | 1 Core,32-Bit | Multimedia; NEON® MPE | LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI | Yes | Keyboard,LCD,Touchscreen | - | USB 2.0 + HSIC | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
Microchip Technology |
문의
|
- |
-
|
MOQ: 1000 MPQ: 1
|
BGA GREEN,IND TEMP,MRLC,512MBIT
|
Tray | SAMA5D2 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | 1 Core,32-Bit | Multimedia; NEON® MPE | LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI | Yes | Keyboard,LCD,Touchscreen | - | USB 2.0 + HSIC | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
NXP USA Inc. |
945
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX25 400MHZ 347MAPBGA
|
Tray | i.MX25 | -40°C ~ 85°C (TA) | 347-LFBGA | 347-MAPBGA (12x12) | ARM926EJ-S | 2.0V,2.5V,2.7V,3.0V,3.3V | 400MHz | 1 Core,32-Bit | - | LPDDR,DDR,DDR2 | No | Keypad,LCD,Touchscreen | - | USB 2.0 + PHY (2) | - | ||||
Microchip Technology |
415
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289-LFBGA
|
Tray | SAMA5D2 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | 1 Core,32-Bit | Multimedia; NEON® MPE | LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI | Yes | Keyboard,LCD,Touchscreen | - | USB 2.0 + HSIC | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
Microchip Technology |
98
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
BGA GREEN,IND TEMP,MRLC,1GBIT D
|
Tray | SAMA5D2 | -40°C ~ 85°C (TA) | 289-TFBGA | 289-TFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | 1 Core,32-Bit | Multimedia; NEON® MPE | LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI | Yes | Keyboard,LCD,Touchscreen | - | USB 2.0 + HSIC | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
Microchip Technology |
20
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
BGA GREEN,IND TEMP,MRLC,1GBIT D
|
Tray | SAMA5D2 | -40°C ~ 85°C (TA) | 289-TFBGA | 289-TFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | 1 Core,32-Bit | Multimedia; NEON® MPE | LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI | Yes | Keyboard,LCD,Touchscreen | - | USB 2.0 + HSIC | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC |