- Series：
-
- Operating Temperature：
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- Package / Case：
-
- Supplier Device Package：
-
- Core Processor：
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- Voltage - I/O：
-
- Speed：
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- Number of Cores/Bus Width：
-
- Co-Processors/DSP：
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- RAM Controllers：
-
- Display & Interface Controllers：
-
- USB：
-
- Security Features：
-
- 선정 된 조건 :
569 제품 검색
 |
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | USB | Security Features | |
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 1000 MPQ: 1
|
I.MX25 32-BIT MPU ARM926EJ-S CO
|
Tape & Reel (TR) | i.MX25 | -40°C ~ 85°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V，3.3V | 400MHz | 1 Core，32-Bit | - | LPDDR，DDR，DDR2 | No | Keypad，LCD，Touchscreen | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure Fusebox，Secure JTAG，Secure Memory，Tamper Detection | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 420 MPQ: 1
|
I.MX27 REV 2.1
|
Tray | i.MX27 | -40°C ~ 85°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | 1 Core，32-Bit | Security; SAHARAH2 | DDR | Yes | Keypad，LCD | - | USB 2.0 + PHY (3) | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 1000 MPQ: 1
|
I.MX 6 SERIES 32-BIT MPU ARM CO
|
Tape & Reel (TR) | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 1000 MPQ: 1
|
I.MX 6 SERIES 32-BIT MPU ARM CO
|
Tape & Reel (TR) | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 1000 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tape & Reel (TR) | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC MPU I.MX50 1.0GHZ 416MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | 416-LFBGA | 416-MAPBGA (13x13) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | Yes | EPDC，LCD | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 1000 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tape & Reel (TR) | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 160 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 160 MPQ: 1
|
I.MX6 SL ROM ENHANCE
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 160 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 750 MPQ: 1
|
I.MX53 32-BIT MPU ARM CORTEX-A8
|
Tape & Reel (TR) | i.MX53 | -20°C ~ 70°C (TA) | 529-FBGA | 529-TEPBGA (19x19) | ARM® Cortex®-A8 | 1.3V，1.8V，2.775V，3.3V | 1GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR2，DDR3 | Yes | Keypad，LCD | SATA 1.5Gbps (1) | USB 2.0 (2)，USB 2.0 + PHY (2) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | |||
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 750 MPQ: 1
|
I.MX53 32-BIT MPU ARM CORTEX-A8
|
Tape & Reel (TR) | i.MX53 | -40°C ~ 125°C (TJ) | 529-FBGA | 529-TEPBGA (19x19) | ARM® Cortex®-A8 | 1.3V，1.8V，2.775V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR2，DDR3 | Yes | Keypad，LCD | SATA 1.5Gbps (1) | USB 2.0 (2)，USB 2.0 + PHY (2) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | |||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 750 MPQ: 1
|
I.MX51 32-BIT MPU ARM CORTEX-A8
|
Tape & Reel (TR) | i.MX51 | -40°C ~ 125°C (TJ) | 529-LFBGA | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 600MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2 | Yes | Keypad，LCD | - | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
|
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 750 MPQ: 1
|
I.MX51 32-BIT MPU ARM CORTEX-A8
|
Tape & Reel (TR) | i.MX51 | -40°C ~ 125°C (TJ) | 529-LFBGA | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 600MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2 | Yes | Keypad，LCD | - | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 750 MPQ: 1
|
I.MX53 32-BIT MPU ARM CORTEX-A8
|
Tape & Reel (TR) | i.MX53 | -40°C ~ 85°C (TA) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V，1.8V，2.775V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR2，DDR3 | Yes | Keypad，LCD | SATA 1.5Gbps (1) | USB 2.0 (2)，USB 2.0 + PHY (2) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | |||
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 420 MPQ: 1
|
I.MX53 32-BIT MPU ARM CORTEX-A8
|
Tray | i.MX53 | -40°C ~ 125°C (TJ) | 529-FBGA | 529-TEPBGA (19x19) | ARM® Cortex®-A8 | 1.3V，1.8V，2.775V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR2，DDR3 | Yes | Keypad，LCD | SATA 1.5Gbps (1) | USB 2.0 (2)，USB 2.0 + PHY (2) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | |||
|
|
NXP USA Inc. |
문의
|
- |
-
|
MOQ: 84 MPQ: 1
|
I.MX53 32-BIT MPU ARM CORTEX-A8
|
Tray | i.MX53 | -40°C ~ 85°C (TA) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V，1.8V，2.775V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR2，DDR3 | Yes | Keypad，LCD | SATA 1.5Gbps (1) | USB 2.0 (2)，USB 2.0 + PHY (2) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | |||
|
|
|
Microchip Technology |
문의
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU POWERPC 66MHZ 357BGA
|
Tray | - | -40°C ~ 110°C (TC) | 357-BBGA | 357-PBGA (25x25) | PowerPC | 3.3V | 66MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | - | - | - | ||
|
|
IDT，Integrated Device Technology Inc |
문의
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC MPU INTERPRISE 266MHZ 256BGA
|
Tray | Interprise | 0°C ~ 70°C (TA) | 256-LBGA | 256-CABGA (17x17) | MIPS32 | 3.3V | 266MHz | 1 Core，32-Bit | - | DDR | No | - | - | - | - | |||
|
|
IDT，Integrated Device Technology Inc |
문의
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC MPU INTERPRISE 266MHZ 256BGA
|
Tray | Interprise | 0°C ~ 70°C (TA) | 256-LBGA | 256-CABGA (17x17) | MIPS32 | 3.3V | 266MHz | 1 Core，32-Bit | - | DDR | No | - | - | - | - |
