326005R00000G

설명 :
BOARD LEVEL HEAT SINK
Attachment Method :
Press Fit
Diameter :
0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Height Off Base (Height of Fin) :
0.375" (9.52mm)
Length :
-
Material :
Aluminum
Material Finish :
Red Anodized
Package Cooled :
TO-5
Power Dissipation @ Temperature Rise :
1.8W @ 90°C
Series :
-
Shape :
Cylindrical
Thermal Resistance @ Forced Air Flow :
30.00°C/W @ 200 LFM
Thermal Resistance @ Natural :
57.00°C/W
Type :
Board Level
Width :
-

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