- Attachment Method :
- SMD Pad
- Diameter :
- -
- Height Off Base (Height of Fin) :
- 0.040" (1.02mm)
- Length :
- 0.080" (2.03mm)
- Material :
- Beryllium Oxide Ceramic
- Material Finish :
- -
- Package Cooled :
- -
- Power Dissipation @ Temperature Rise :
- -
- Series :
- Q-Bridge
- Shape :
- Rectangular
- Thermal Resistance @ Forced Air Flow :
- -
- Thermal Resistance @ Natural :
- 7.00°C/W
- Type :
- Heat Spreader
- Width :
- 0.050" (1.27mm)
