이미지는 참조 용입니다.
- Contact Finish - Mating :
- Tin-Lead
- Contact Finish - Post :
- Tin-Lead
- Contact Finish Thickness - Mating :
- 200μin (5.08μm)
- Contact Finish Thickness - Post :
- 200μin (5.08μm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- Closed Frame
- Housing Material :
- Fluoropolymer (FP)
- Mounting Type :
- Chassis Mount
- Number of Positions or Pins (Grid) :
- 3 (Oval)
- Operating Temperature :
- -55°C ~ 125°C
- Packaging :
- Bulk
- Pitch - Mating :
- -
- Pitch - Post :
- -
- Series :
- 8080
- Termination :
- Solder
- Type :
- Transistor，TO-3
- 倍数 :
- 1
