258

설명 :
.5X.25X.34 HEATSINK FOR DIODE
Attachment Method :
Type 120 Compound
Diameter :
-
Height Off Base (Height of Fin) :
0.340" (8.64mm)
Length :
0.250" (6.35mm)
Material :
Aluminum
Material Finish :
-
Package Cooled :
Stud Mounted Diode
Power Dissipation @ Temperature Rise :
-
Series :
258
Shape :
Rectangular
Thermal Resistance @ Forced Air Flow :
-
Thermal Resistance @ Natural :
12.00°C/W
Type :
Board Level
Width :
0.500" (12.70mm)

유사 제품