- Series：
-
- Type：
-
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
4 제품 검색
 |
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
Advanced Thermal Solutions Inc. |
118
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 288X188X16.5MM
|
- | Top Mount | Aluminum | Rectangular, Fins | 7.402" (188.00mm) | 7.402" (188.00mm) | Adhesive | - | - | 0.60°C/W @ 600 LFM | 4.00°C/W | Degreased | |||
|
|
|
Wakefield-Vette |
4,378
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.65"
|
628 | Top Mount | Aluminum | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM | - | Black Anodized | ||
|
|
|
Wakefield-Vette |
1,000
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
ANCHOR HEATSINK 23X23X16.5MM
|
Wave 2x | Board Level | Aluminum Alloy | Square, Angled Fins | 0.906" (23.00mm) | 0.906" (23.00mm) | Clip | BGA | - | 5.08°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
Wakefield-Vette |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.65"
|
628 | Top Mount | Aluminum | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM | - | Black Anodized |
