- Series：
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- Type：
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- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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3 제품 검색
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이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|
|
|
Wakefield-Vette |
4,378
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.65"
|
628 | Top Mount | Aluminum | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM | ||
|
|
|
Wakefield-Vette |
1,000
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
ANCHOR HEATSINK 23X23X16.5MM
|
Wave 2x | Board Level | Aluminum Alloy | Square, Angled Fins | 0.906" (23.00mm) | 0.906" (23.00mm) | Clip | BGA | - | 5.08°C/W @ 200 LFM | ||
|
|
|
Wakefield-Vette |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.65"
|
628 | Top Mount | Aluminum | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM |
