- Material：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- 선정 된 조건 :
17 제품 검색
 |
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
18,195
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.5W LOW PROFILE
|
- | Board Level | Aluminum | Square, Fins | 0.750" (19.05mm) | Bolt On | TO-220 | 0.380" (9.65mm) | 2.5W @ 60°C | 10.00°C/W @ 200 LFM | 24.00°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
6,080
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 19.05x9.52MM
|
- | Board Level | Aluminum | Square, Fins | 0.750" (19.05mm) | Bolt On | TO-220 | 0.375" (9.52mm) | - | - | 24.00°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
6,905
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 LOW HEIGHT BLK
|
273 | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Bolt On | TO-220, TO-218 | 0.375" (9.52mm) | 2.0W @ 49°C | 7.20°C/W @ 400 LFM | 24.50°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
15,536
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375"TO-220
|
- | Board Level, Vertical | Copper | Rectangular, Fins | 0.750" (19.05mm) | Bolt On and PC Pin | TO-220 | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 25.80°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2,586
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 1.75" HIGH RISE TO-220
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.750" (44.45mm) | Clip and Board Mounts | TO-220 | 1.750" (44.45mm) | 4.0W @ 30°C | 2.00°C/W @ 400 LFM | 6.30°C/W | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
2,568
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 LOW PROFILE
|
- | Board Level | Aluminum | Square, Fins | 0.750" (19.05mm) | Bolt On | TO-220 | 0.375" (9.52mm) | - | 10.00°C/W @ 200 LFM | 24.00°C/W | Black Anodized | |||
|
|
|
t-Global Technology |
160
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
PH3 76.2X19.1X0.21MM
|
PH3 | Heat Spreader | Copper | Rectangular | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
|
|
|
t-Global Technology |
49
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X19.1X0.062MM
|
PH3n | Heat Spreader | Copper | Rectangular | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester | ||
|
|
|
t-Global Technology |
11
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X19.1X0.07MM
|
PH3n | Heat Spreader | Copper | Rectangular | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
|
|
Advanced Thermal Solutions Inc. |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 HOR MNT LOW PRO
|
- | Board Level | Aluminum | Square, Fins | 0.750" (19.05mm) | Bolt On | TO-220 | 0.375" (9.52mm) | - | 10.00°C/W @ 200 LFM | 24.00°C/W | Black Anodized | |||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Bolt On | TO-202 | 0.375" (9.52mm) | 1.5W @ 40°C | 10.00°C/W @ 200 LFM | 21.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Aluminum | Rectangular | 1.000" (25.40mm) | Clip | TO-220 | 0.350" (8.89mm) | 1.0W @ 30°C | 16.00°C/W @ 200 LFM | 26.00°C/W | Black Anodized | ||
|
|
Seeed Technology Co., Ltd |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
ULTRATHIN HEAT SINK FOR CUBIEBOA
|
- | Top Mount | - | Square, Fins | 0.750" (19.05mm) | Adhesive | - | 0.205" (5.21mm) | - | - | - | - | |||
|
|
|
CTS Thermal Management Products |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK VERT .187"H BLK TO-220
|
7 | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Bolt On and PC Pin | TO-220 | 0.187" (4.75mm) | 1.5W @ 50°C | - | 33.90°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK VERT .375"H BLK TO-220
|
7 | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Bolt On | TO-220 | 0.375" (9.52mm) | 2.0W @ 50°C | - | 27.00°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK HORZ .375"H BLK TO-220
|
- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Bolt On | TO-126, TO-127, TO-220 | 0.375" (9.52mm) | - | - | 27.30°C/W | Black Anodized | ||
|
|
|
Comair Rotron |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 9.5X19X19MM
|
- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | Bolt On | TO-220 | 0.375" (9.52mm) | 1.0W @ 30°C | 6.00°C/W @ 500 LFM | - | Black Anodized |
