- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
4 제품 검색
 |
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
t-Global Technology |
160
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
PH3 76.2X19.1X0.21MM
|
PH3 | Heat Spreader | Copper | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
|
|
|
t-Global Technology |
49
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X19.1X0.062MM
|
PH3n | Heat Spreader | Copper | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester | ||
|
|
|
t-Global Technology |
11
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X19.1X0.07MM
|
PH3n | Heat Spreader | Copper | 3.000" (76.20mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Aluminum | 1.000" (25.40mm) | Clip | TO-220 | 0.350" (8.89mm) | 1.0W @ 30°C | 16.00°C/W @ 200 LFM | 26.00°C/W | Black Anodized |
