- Series：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- 선정 된 조건 :
56 제품 검색
 |
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
Advanced Thermal Solutions Inc. |
4,769
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 9MM
|
maxiFLOW | Top Mount | Square, Angled Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | ASIC | 0.354" (9.00mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized | |||
|
|
|
CTS Thermal Management Products |
1,686
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Square, Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 7.10°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
4,900
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Square, Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 4.00°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
3,861
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Square, Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 7.10°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
1,900
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Square, Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
1,092
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 9.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Square, Angled Fins | 0.748" (19.00mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | 16.70°C/W @ 200 LFM | - | Black Anodized | |||
|
|
|
Wakefield-Vette |
385
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 19X19X12MM PIN
|
901 | Top Mount | Square, Pin Fins | 0.748" (19.00mm) | Clip | BGA | 0.457" (11.60mm) | - | 6.60°C/W @ 200 LFM | 12.70°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
402
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 19X19X23MM PIN
|
901 | Top Mount | Square, Pin Fins | 0.748" (19.00mm) | Clip | BGA | 0.892" (22.65mm) | - | 5.40°C/W @ 200 LFM | 10.60°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
371
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Square, Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
363
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 9.5MM
|
- | Top Mount | Square, Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 24.00°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
595
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 14.5MM
|
- | Top Mount | Square, Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | 0.3W @ 20°C | 12.00°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
115
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 12.5MM
|
maxiFLOW | Top Mount | Square, Angled Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.492" (12.50mm) | - | 10.20°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
|
Wakefield-Vette |
308
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 19X19X23MM ELLIPTICAL
|
901 | Top Mount | Square, Fins | 0.748" (19.00mm) | Clip | BGA | 0.892" (22.65mm) | - | 4.90°C/W @ 200 LFM | 12.00°C/W | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
475
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 9MM
|
maxiFLOW | Top Mount | Square, Angled Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Not Included) | ASIC | 0.354" (9.00mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
1,116
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 7.5MM
|
maxiFLOW | Top Mount | Square, Angled Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | - | 16.50°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
211
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 24.5MM
|
- | Top Mount | Square, Fins | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | - | 7.10°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
575
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 17.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Square, Angled Fins | 0.748" (19.00mm) | Clip, Thermal Material | BGA | 0.689" (17.50mm) | - | 7.70°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
568
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 19X19X7.5MM
|
superGRIP | Top Mount | Square, Fins | 0.748" (19.00mm) | Clip, Thermal Material | BGA | 0.295" (7.50mm) | - | 22.00°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
215
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 19X19X7.5MM
|
maxiFLOW, superGRIP | Top Mount | Square, Angled Fins | 0.748" (19.00mm) | Clip, Thermal Material | BGA | 0.295" (7.50mm) | - | 16.50°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
119
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 19X19X17.5MM
|
maxiFLOW, superGRIP | Top Mount | Square, Angled Fins | 0.748" (19.00mm) | Clip, Thermal Material | BGA | 0.689" (17.50mm) | - | 7.70°C/W @ 200 LFM | - | Blue Anodized |
