- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
4 제품 검색
 |
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
이미지 | 부품 번호 | 제조사 | 수량 | 배달 기간 | 단가 | 구매 | 설명 | Series | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | |
|
|
|
CTS Thermal Management Products |
1,686
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | ||
|
|
|
CTS Thermal Management Products |
3,861
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | ||
|
|
Advanced Thermal Solutions Inc. |
211
|
3 일 |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 24.5MM
|
- | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | |||
|
|
Advanced Thermal Solutions Inc. |
문의
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 19X19X24.5MM W/OUT TIM
|
- | Thermal Tape, Adhesive (Not Included) | BGA | 0.964" (24.50mm) |
