BDN11-3CB/A01

설명 :
HEATSINK CPU W/ADHESIVE 1.11"SQ
Attachment Method :
Thermal Tape, Adhesive (Included)
Diameter :
-
Height Off Base (Height of Fin) :
0.355" (9.02mm)
Length :
1.110" (28.19mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise :
-
Series :
BDN
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
7.20°C/W @ 400 LFM
Thermal Resistance @ Natural :
20.90°C/W
Type :
Top Mount
Width :
1.110" (28.19mm)

유사 제품