- Attachment Method :
- Thermal Tape, Adhesive (Included)
- Diameter :
- -
- Height Off Base (Height of Fin) :
- 0.555" (14.10mm)
- Length :
- 1.210" (30.73mm)
- Material :
- Aluminum
- Material Finish :
- Black Anodized
- Package Cooled :
- Assorted (BGA, LGA, CPU, ASIC...)
- Power Dissipation @ Temperature Rise :
- -
- Series :
- BDN
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 5.20°C/W @ 400 LFM
- Thermal Resistance @ Natural :
- 16.50°C/W
- Type :
- Top Mount
- Width :
- 1.210" (30.73mm)